Title:
THERMOPLASTIC RESIN COMPOSITION FOR FOAM MOLDING AND FOAM MOLDING OF THE SAME
Document Type and Number:
Japanese Patent JP2022128055
Kind Code:
A
Abstract:
To provide a thermoplastic resin composition for foam molding which enables molding of a foam molding that has a uniform and fine foam cell structure and is excellent in surface appearance.SOLUTION: A thermoplastic resin composition for foam molding contains 0.1-10 pts.mass of a high-molecular-weight resin (D) having a weight average molecular weight of 2,000,000 or more with respect to 100 pts.mass of the total of 1-20 pts.mass of the following component (A), 0-50 pts.mass of the following component (B), and 40-90 pts.mass of the following component (C). Component (A): rubber-reinforced styrenic resin (A) obtained by polymerizing a vinyl monomer (b1) containing an aromatic vinyl compound in the presence of a rubbery polymer (a). Component (B): a styrenic resin (B) obtained by polymerizing a vinyl monomer (b2) containing an aromatic vinyl compound. Component (C): aromatic polycarbonate resin (C).SELECTED DRAWING: None
Inventors:
ANDO HIROKI
HIRAISHI KENTARO
HIRAISHI KENTARO
Application Number:
JP2021026367A
Publication Date:
September 01, 2022
Filing Date:
February 22, 2021
Export Citation:
Assignee:
TECHNO UMG CO LTD
International Classes:
C08J9/04; C08L15/00; C08L25/08; C08L69/00
Attorney, Agent or Firm:
Tsuyoshi Shigeno
Takayuki Shigeno
Takayuki Shigeno
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