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Title:
THERMOPLASTIC RESIN COMPOSITION FOR HANDLING ELECTRONIC PART AND MOLDED ARTICLE FOR HANDLING ELECTRONIC PART
Document Type and Number:
Japanese Patent JP2001049130
Kind Code:
A
Abstract:

To provide a thermoplastic resin molded article for handling electronic parts, such as a carrier for magnetic heads (made of magneto-resistive elements), scarcely giving the parts electronic damage caused by electrostatic discharge, excessive conduction of a contact current, etc.

This thermoplastic resin composition used for molding an article for handling electronic parts comprises compounding 100 pts.wt. of a thermoplastic resin, such as polycarbonate resin, with 5-100 pts.wt. of carbon fiber and further with 1-100 pts.wt. of a polymeric antistatic agent, wherein the resin composition has an electrical surface resistance of 103 to 1012 Ω. The molded article for handling electronic parts is obtained by molding the thermoplastic resin composition used for molding the article for handling electronic parts.


Inventors:
TANAKA SHIGERU
ASANO ETSUJI
TANAKA TOMOHIKO
SAGISAKA KOICHI
Application Number:
JP22419599A
Publication Date:
February 20, 2001
Filing Date:
August 06, 1999
Export Citation:
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Assignee:
ALPS ELECTRIC CO LTD
YUKA DENSHI KK
MITSUBISHI CHEM CORP
International Classes:
G11B5/39; B29C70/68; B65D85/86; C08K7/06; C08L101/00; C08L101/16; G11B5/127; (IPC1-7): C08L101/16; B29C70/68; B65D85/86; C08K7/06; G11B5/127; G11B5/39
Domestic Patent References:
JPH07228707A1995-08-29
JPH11269362A1999-10-05
JPH1171508A1999-03-16
JPH11106665A1999-04-20
Attorney, Agent or Firm:
Tsuyoshi Shigeno



 
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