Title:
THERMOPLASTIC RESIN COMPOSITION FOR HEAT RADIATING ELECTRIC AND ELECTRONIC PARTS AND HEAT RADIATING ELECTRIC AND ELECTRONIC PARTS MADE THEREOF
Document Type and Number:
Japanese Patent JP2015025025
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition for heat radiating electric and electronic parts, which is excellent in heat conductivity, mechanical strength and flowability at injection molding, enables burr occurring at injection molding to be reduced and can provide heat radiating electric and electronic parts excellent in surface appearance.SOLUTION: The thermoplastic resin composition for heat radiating electric and electronic parts is provided which is produced by blending 25 to 45 wt.% of (A) a polyamide resin, 25 to 74 wt.% of (B) magnesium hydroxide and 1 to 40 wt.% of (C) a glass fiber provided that the total of (A), (B) and (C) is 100 wt.%, and which has a heat conductivity measured by a heat flow sensor method of 1 W/m K or more and satisfies following (I) to (III). (I) a relative viscosity of 0.01 g/ml of 98% sulfuric acid solution of the polyamide resin extracted from the thermoplastic resin composition at 25°C is 1.5 to 2.8. (II) the melting point of the thermoplastic resin composition is 200 to 300°C. (III) difference between the melting point and the temperature-falling crystallization temperature is 45 to 70°C.
Inventors:
AKITA DAI
UMEZU HIDEYUKI
UMEZU HIDEYUKI
Application Number:
JP2013153400A
Publication Date:
February 05, 2015
Filing Date:
July 24, 2013
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C08L77/00; C08K3/22; C08K7/14
Domestic Patent References:
| JPH11100498A | 1999-04-13 | |||
| JP2012144626A | 2012-08-02 | |||
| JPH04300956A | 1992-10-23 | |||
| JP2009215534A | 2009-09-24 | |||
| JPH08134207A | 1996-05-28 | |||
| JP2015503014A | 2015-01-29 | |||
| JPH11279399A | 1999-10-12 |
Foreign References:
| WO2013024593A1 | 2013-02-21 |