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Patent Searching and Data


Title:
THERMOPLASTIC RESIN COMPOSITION, ITS PREPARATION PROCESS, SHEET AND CARD
Document Type and Number:
Japanese Patent JP2002121365
Kind Code:
A
Abstract:

To provide a thermoplastic resin composition suitable for cards, which is excellent in emboss processibility and in impact resistance such as a magnetic card, an IC card, and the like.

This resin composition is obtained by blending an inorganic platy filler with a thermoplastic resin selected from an amorphous polyester and an aromatic polycarbonate. The inorganic platy filler is preliminarily mixed with the thermoplastic resin and master pellets are prepared to achieve melting- mixing. The ratio of the melt flow rates of the thermoplastic resin before and after the preliminary mixing is in the range of 0.1-10.


Inventors:
KOBAYASHI SADAYUKI
KARASAWA HIROO
Application Number:
JP2000318700A
Publication Date:
April 23, 2002
Filing Date:
October 19, 2000
Export Citation:
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Assignee:
TORAY INDUSTRIES
International Classes:
B42D15/10; C08J3/22; C08K5/541; C08K7/00; C08L67/00; C08L69/00; G11B5/73; G11B5/733; (IPC1-7): C08L67/00; B42D15/10; C08J3/22; C08K5/541; C08K7/00; C08L69/00; G11B5/73