To obtain a curable resin composition having excellent dielectric characteristics, mechanical characteristics and excellent chemical resistance, heat resistance, etc., after curing by making the composition include a curable polyphenylene ether-based resin composition, silica, a hydrogenated block copolymer containing a vinyl aromatic compound, etc., in a specific ratio.
This composition comprises (A) a curable polyphenylene ether- based resin composition, (B) silica and (C) a hydrogenated block copolymer obtained by hydrogenating a block copolymer composed of a polymer block A consisting essentially of at least one vinyl aromatic compound and a polymer block B consisting essentially of at least one conjugated diene compound. The composition is composed of 10-400 pts.wt. of the component B and 1-50 pts.wt. of the component C based on 100 pts.wt. of the component A and the ratio of spherical silica in particles of the component B is ≥1% and ≤99%; among the particles of the component B.
ARAI YUSHI
YAMASHITA HIDETOSHI
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