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Patent Searching and Data


Title:
THERMOPLASTIC RESIN COMPOSITION AND MELDED PRODUCT THEREOF
Document Type and Number:
Japanese Patent JP2001316532
Kind Code:
A
Abstract:

To obtain a thermoplastic resin composition capable of preparing a molded product without deteriorating excellent transparency which an interpolymer such as ethylene-styrene copolymer essentially possesses and providing the molded product excellent in transparency, flame retardancy, flexibility and damage resistance.

This thermoplastic resin composition is characterized by including (A) 10-99 wt.% of a substantially random interpolymer, e.g. the ethylene- styrene copolymer, composed of 15-85 mol% of a polymer unit derived from an aromatic vinyl or vinylidene monomer and/or a hindered aliphatic or a cyclic aliphatic vinyl or vinylidene monomer and 15-85 mol% of a polymer unit derived from ethylene, an α-olefin having a 3-20C or the combination of the compounds and (B) 1-90 wt.% of an inorganic filler, e.g. magnesium hydroxide and having ≤80% haze value measured by 1 mm thickness of the molded product when preparing the molded product from the composition. The molded product is made of the composition.


Inventors:
MORIYA SATORU
KIMURA TOMOHIKO
Application Number:
JP2000134286A
Publication Date:
November 16, 2001
Filing Date:
April 28, 2000
Export Citation:
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Assignee:
MITSUI CHEMICALS INC
International Classes:
C08J5/00; C08F210/00; C08F212/00; C08K3/00; C08K3/22; C08L23/00; (IPC1-7): C08L23/00; C08F210/00; C08F212/00; C08J5/00; C08K3/00; C08K3/22
Attorney, Agent or Firm:
Shunichiro Suzuki (1 person outside)