Title:
熱可塑性樹脂組成物、その製造方法及びそれから製造された成形品
Document Type and Number:
Japanese Patent JP7417717
Kind Code:
B2
Abstract:
The present invention relates to a thermoplastic resin composition, a method of preparing the same, and a molded article manufactured using the same. More particularly, the present invention relates to a thermoplastic resin composition including 100 parts by weight of a base resin including 10 to 50 % by weight of a vinyl cyanide compound-conjugated diene compound-aromatic vinyl compound graft copolymer (A); 10 to 55 % by weight of a vinyl cyanide compound-conjugated diene compound-aromatic vinyl compound copolymer (B); 4 to 11 % by weight of an acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (C) having a graft ratio of 40 to 60 % and a weight average molecular weight of 150,000 to 200,000 g/mol; 3.5 to 9 % by weight of a vinyl cyanide compound-aromatic vinyl compound copolymer (D) having a weight average molecular weight of 1,000,000 to 2,500,000 g/mol; and 1 to 20 % by weight of a branched vinyl cyanide compound-aromatic vinyl compound copolymer (E) having a weight average molecular weight of 300,000 to 800,000 g/mol and 0.1 to 2.5 parts by weight of a high-density polyethylene resin (F) having a density of 0.9 to 1.5 g/cm3 and a weight average molecular weight of 1,000 to 6,500 g/mol, a method of preparing the thermoplastic resin composition, and a molded article manufactured using the thermoplastic resin composition.According to the present invention, a thermoplastic resin composition having excellent blow moldability and a wide range of molding temperatures, a method of preparing the same, and a molded article manufactured using the same may be provided.
Inventors:
Junho Choi
Song Ryung Kim
De San Jun
Heo Nam Goong
Seok Hee Jo
Song Ryung Kim
De San Jun
Heo Nam Goong
Seok Hee Jo
Application Number:
JP2022520518A
Publication Date:
January 18, 2024
Filing Date:
July 06, 2021
Export Citation:
Assignee:
LG HAUSYS,LTD.
International Classes:
C08L55/02; C08L23/06; C08L25/12; C08L25/16; C08L33/24; C08L51/06
Domestic Patent References:
| JP6299044A | ||||
| JP2002201329A | ||||
| JP2016138197A | ||||
| JP2001214026A |
Attorney, Agent or Firm:
Shinya Mihiro
Watanabe Takashi
Watanabe Takashi