Title:
THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE THEREOF
Document Type and Number:
Japanese Patent JP2008019355
Kind Code:
A
Abstract:
To provide a thermoplastic resin composition suitable for effective utilization of wood flour including by-produced wood flour and recycled wood flour, having excellent moldability and providing a molded article having excellent characteristics; and to provide the molded article.
The thermoplastic resin composition comprises (A) a thermoplastic resin, (B) 20-70 wt.% organic filler, (C) 0.2-2.5 wt.% olefin-maleic anhydride copolymer and/or modified product of the olefin-maleic anhydride copolymer, (D) one or more selected from 0.1-1.5 wt.% fatty acid amide, 0.1-2.0 wt.% liquid paraffin, and 0.1-2.0 wt.% alcohol having 50C melting point and 150C boiling point, and (E) 0.1-10 wt.% inorganic filler and/or 0.1-2.0 wt.% organic lubricant.
Inventors:
YUYAMA TOMOAKI
MASAOKA HIROSHI
ITO KOICHI
MASAOKA HIROSHI
ITO KOICHI
Application Number:
JP2006193092A
Publication Date:
January 31, 2008
Filing Date:
July 13, 2006
Export Citation:
Assignee:
CHISSO CORP
LUCITE JAPAN KK
LUCITE JAPAN KK
International Classes:
C08L23/00; C08K3/00; C08K5/20; C08K5/50; C08L1/00
Domestic Patent References:
| JP2005200615A | 2005-07-28 | |||
| JP2005200614A | 2005-07-28 | |||
| JP2006131729A | 2006-05-25 | |||
| JP2005263852A | 2005-09-29 |
Foreign References:
| WO2006044400A1 | 2006-04-27 |
Attorney, Agent or Firm:
Yoshiyuki Kawaguchi
Hidemi Matsukura
Tsutomu Toyama
Hidemi Matsukura
Tsutomu Toyama