THERMOPLASTIC RESIN COMPOSITION AND THERMOPLASTIC RESIN MOLDED ARTICLE

Title:

THERMOPLASTIC RESIN COMPOSITION AND THERMOPLASTIC RESIN MOLDED ARTICLE

Document Type and Number:

Japanese Patent JP2009280650

Kind Code:

A

Abstract:

To provide a thermoplastic resin composition that exhibits good moldability while suppressing a loaded amount of a filler and has high insulation properties, a high thermoconductivity in the direction of resin flow on molding and high mechanical strengths, and a thermoplastic resin molded article composed of the same.

The thermoplastic resin composition contains scaly boron nitride and boron nitride has a particle size of a single particle of at least 18 m, preferably at least 35 m. The loaded amount of boron nitride is 30-65 vol.%, preferably 40-55 vol.% based on the total volume of the thermoplastic resin and boron nitride. The thermoplastic resin is preferably a molten liquid crystalline resin having a wholly aromatic polyester skeleton in its main chain.

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Inventors:

KAMIHOGI YUTETSU
IWATSUKI YASUHITO
YAMANAKA HIROYUKI
SUZUKI MASAHIRO
HOJO FUSAO

Application Number:

JP2008131741A

Publication Date:

December 03, 2009

Filing Date:

May 20, 2008

Export Citation:

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Assignee:

SHIN KOBE ELECTRIC MACHINERY

International Classes:

C08L101/00; C08K7/00; C08L67/03

Domestic Patent References:

JP2002030223A	2002-01-31
JP2004051852A	2004-02-19
JPH11320730A	1999-11-24
JPH11226991A	1999-08-24

Foreign References:

WO2009116357A1

2009-09-24

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