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Patent Searching and Data


Title:
THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
Japanese Patent JP2010095553
Kind Code:
A
Abstract:

To provide a resin composition excellent in impact resistance in severe temperature environments, in which temperature in use is increased or decreased from below zero to high temperature above 100C, such as high-voltage penetration type capacitors or high-voltage relays and peripheral members thereof.

The thermoplastic resin composition comprises, based on (A) 100 pts.wt. of polybutylene terephthalate, (B) 10-60 pts.wt. of block copolymer of terephthalic acid, 1,4-butanediol, and tetramethylene glycol, and (C) 10-50 pts.wt. of ethylene butylacrylate.


Inventors:
Tsubone, Myoko
Maeda, Yasuo
Niinai, Satoru
Application Number:
JP2008000264716
Publication Date:
April 30, 2010
Filing Date:
October 14, 2008
Export Citation:
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Assignee:
TORAY IND INC
International Classes:
C08L67/03; C08L23/08; C08L33/16