To solve the problem in which in a packaging container for a silicon wafer or photomask manufactured in a semiconductor manufacturing process, conventionally used polycarbonate (PC) or polypropylene (PP) cannot respond to requirement of a sophisticated quality such that the container itself does not release moisture or a contaminant such as a chemical substance (frequently in an organic gas form) as well as it can effectively be protected from moisture or chemical substances from the outside of the container, use of a composite material including carbon black or a resin with low water content or less impurities or the like is thus proposed as a solution, but it is not enough for practical use.
The thermoplastic resin composition comprises 60-98 pts.mass of a cyclic olefin resin; 1-20 pts.mass of an olefinic and/or styrenic elastomer; and 1-20 pts.mass of a particular conductive filler, and is excellent in antifouling property and resistant to impact. A molded article thereof is also provided.
EHATA KATSUYOSHI
NIKAIDO MASANORI
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