Title:
半導体用熱可塑性樹脂組成物、これを用いた接着フィルム、リードフレーム、半導体装置および半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4900244
Kind Code:
B2
Abstract:
The object of the present invention is to provide an adhesion film for semiconductor that is capable of bonding a semiconductor chip to a lead frame tightly at an adhesion temperature lower than that of the adhesion film of a traditional polyimide resin without generation of voids and that can also be used for protection of lead frame-exposed area, a thermoplastic resin composition for semiconductor for use in the adhesive agent layer therein, and a lead frame having the adhesive film and a semiconductor device; and, to achieve the object, the present invention provides a thermoplastic resin composition for semiconductor, comprising a thermoplastic resin obtained in reaction of an amine component containing an aromatic diamine mixture (A) containing 1,3-bis(3-aminophenoxy)benzene, 3-(3′-(3″-aminophenoxy)phenyl)amino-1-(3′-(3″-aminophenoxy)phenoxy)benzene and 3,3′-bis(3″-aminophenoxy)diphenylether, and an acid component (C), an adhesion film for semiconductor using the same, a lead frame having the adhesion film and a semiconductor device using the same.
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Inventors:
Seihide Tateoka
Kiyasu Kawai
Yoshiyuki Tanabe
Tomohiro Meiko
Naoko Tomoda
Kiyasu Kawai
Yoshiyuki Tanabe
Tomohiro Meiko
Naoko Tomoda
Application Number:
JP2007526017A
Publication Date:
March 21, 2012
Filing Date:
July 18, 2006
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08G73/10; C08G73/16; C08J5/18; C08L79/08; C09J7/35; C09J177/06; H01L21/52; H01L21/56; H01L23/50
Domestic Patent References:
| JPH05105850A | 1993-04-27 | |||
| JP2004151191A | 2004-05-27 | |||
| JPH1149855A | 1999-02-23 |
Attorney, Agent or Firm:
Hidekazu Miyoshi