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Title:
THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2013010973
Kind Code:
A
Abstract:

To provide a thermoplastic resin composition few in commingling of transparent foreign matter, and excellent in transparency, appearance of a molded item; heat resistance, weatherability, and mechanical strength such as elongation at break and impact strength.

This thermoplastic resin composition includes an aromatic polycarbonate and thermal stabilizer, and as necessary, ultraviolet absorber and mold release agent, where the aromatic polycarbonate is obtained by melt polymerization of an aromatic dihydroxy compound and a diester carbonate compound; where the number N (pieces/g) of transparent foreign matters of ≥10 μm and a viscosity-averaged molecular weight Mv satisfy the formula; (1) or (2): N≤exp(6.824×10-4×Mv-8.626) (1) when Mv≤21,000; and N≤exp(8.514×10-5×Mv+3.916) (2) when Mv>21,000.


Inventors:
NAKANO HIROSHI
MIYAMOTO MASAAKI
TAYAMA TAKAO
YAMAMOTO MASANORI
HYODO NARUTOSHI
KINOSHITA HIDEKI
Application Number:
JP2012231220A
Publication Date:
January 17, 2013
Filing Date:
October 18, 2012
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP
MITSUBISHI ENG PLASTICS CORP
International Classes:
C08L69/00; C08G64/06; C08K5/09; C08K5/10; C08K5/13; C08K5/3467
Domestic Patent References:
JP2001115002A2001-04-24
JPH0970852A1997-03-18
JPH06179744A1994-06-28
JPH05202179A1993-08-10
JP2000159880A2000-06-13
JPH05239334A1993-09-17
Attorney, Agent or Firm:
Kazuhiko Okada