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Title:
THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP61293260
Kind Code:
A
Abstract:

PURPOSE: To provide the titled compsn. having excellent mechanical characteristics and moldability, by blending two thermoplastic resins, an epoxy group-contg. (-free) styrene resin and a low-molecular hydrocarbon resin.

CONSTITUTION: 100% (by weight; the same applies hereinbelow) mixture of 5W95% thermoplastic resin (A) (e.g. polyester) having a m.p. of 150W300°C and contg. at least one polar group selected from among COOH, OH and NH2 groups, 0.01W50% epoxy group-contg. styrene resin (B) contg. 0.5W30% copolymerizable unsaturated monomer contg. an epoxy group, 0W90% epoxy group-contg. (-free) styrene resin (C) and 0W90% thermoplastic resin (D) (e.g. polyphenylene ether resin) compatible with component C in an amount of at least 5% of the combined amount of components C and D, 0.01W50% low- molecular hydrocarbon resin (E) (e.g. cumarone/indene resin) and optionally, not more than 3pts.wt. (per 100pts.wt. component A) additives such as nucleating agent, antioxidant, stabilizer, etc., are blended together.


Inventors:
Hiramatsu, Toshio
Hara, Yuzuru
Kobayashi, Shigeo
Application Number:
JP1985000135348
Publication Date:
December 24, 1986
Filing Date:
June 20, 1985
Export Citation:
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Assignee:
TOYOBO CO LTD
International Classes:
C08L101/00; C08G59/00; C08L7/00; C08L21/00; C08L25/04; C08L33/00; C08L33/02; C08L45/00; C08L45/02; C08L51/00; C08L51/02; C08L51/04; C08L53/00; C08L53/02; C08L63/00; C08L67/00; C08L71/00; C08L71/12; C08L73/00; C08L77/00; (IPC1-7): C08L101/00