Title:
THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH05320497
Kind Code:
A
Abstract:
PURPOSE:To obtain a thermoplastic resin composition which can give a molding excellent in permanent antistatic properties, mechanical properties and heat resistance with an excellent balance among them and improved in delamination resistance. CONSTITUTION:This composition comprises 1-40 pts.wt. polyamide elastomer containing a soft component comprising a polyalkylene glycol based on polyethylene glycol, 95-1 pt.wt. polyphenylene ether, 1-60 pts.wt. polyamide resin, 0.1-50 pts.wt. modified vinyl polymer containing at least one kind of functional groups selected from among carboxyl, epoxy, amino, hydroxyl, polyalkylene oxide and oxazoline groups and 0-95 pts.wt. styrenic resin (the total of the amounts of the above components being 100 pts.wt.).
Inventors:
FUKUMOTO TADAO
CHIBA KAZUMASA
CHIBA KAZUMASA
Application Number:
JP13490692A
Publication Date:
December 03, 1993
Filing Date:
May 27, 1992
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C08K3/24; C08L25/04; C08L71/00; C08L71/12; C08L73/00; C08L77/00; C08L101/00; C08L101/02; (IPC1-7): C08L71/12; C08K3/24; C08L25/04; C08L71/12; C08L77/00; C08L101/02