Title:
THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH0570635
Kind Code:
A
Abstract:
PURPOSE:To obtain the subject composition giving a molded article such as film and sheet having excellent appearance and transparency by compounding an acrylic monomer and a low-molecular weight polyolefin to a resin composition composed of a polyolefin, an aromatic polyester and a specific saponified polymer, etc. CONSTITUTION:The objective composition having highly balanced physical properties such as moldability, rigidity, heat-resistance, impact resistance, gas- barrierness and oil-resistance is produced by compounding (A) 100 pts.wt. of a resin composition composed of (i) 5-29wt.% of a polyolefin, (ii) 1-90wt.% of an aromatic polyester such as polyethylene terephthalate and (iii) 1-90wt.% of a polyamide such as nylon 6 and/or a saponified ethylene-vinyl acetate copolymer with (B) 0.1-20 pts.wt. of beta-carboxyethyl acrylate monomer, and/or allylureide monomer, (C) 0.01-10 pts.wt. of an organic peroxide and (D) 1-20 pts.wt. of a low-molecular weight polyolefin.
Inventors:
FURUKAWA SADAFUMI
Application Number:
JP23587691A
Publication Date:
March 23, 1993
Filing Date:
September 17, 1991
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08K5/10; C08K5/14; C08L23/00; C08L23/26; C08L29/04; C08L31/00; C08L51/06; C08L53/00; C08L55/00; C08L67/00; C08L67/02; C08L77/00; (IPC1-7): C08K5/10; C08K5/14; C08L23/00; C08L23/26; C08L29/04; C08L31/00; C08L51/06; C08L53/00; C08L67/02; C08L77/00
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