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Title:
THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH06322256
Kind Code:
A
Abstract:

PURPOSE: To obtain a resin compsn. with a good melt flowability and an excellent moldability.

CONSTITUTION: 100 pts.wt. resin component comprising 10-90wt.% polyphenylene ether resin and 90-10wt.% polyamide resin is compounded with 0.1-90 pts.wt. lactone compd., giving a resin compsn.


Inventors:
TOKUDA TAKASHI
WATANABE AKIHIKO
HIRATSUKA MOTONORI
Application Number:
JP10709693A
Publication Date:
November 22, 1994
Filing Date:
May 07, 1993
Export Citation:
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Assignee:
TORAY INDUSTRIES
International Classes:
C08L25/04; C08K5/15; C08K5/151; C08L71/00; C08L71/12; C08L73/00; C08L77/00; (IPC1-7): C08L71/12; C08K5/15; C08L25/04; C08L71/12; C08L77/00



 
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