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Title:
THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH07109391
Kind Code:
A
Abstract:

PURPOSE: To provide the composition comprising a polyamideimide elastomer, a polycarbonate resin, a styrenic resin and an electrolyte in a specific ratio, excellent in conductivity, heat resistance and mechanical characteristics, and having permanent antistaticity.

CONSTITUTION: This composition comprises (A) a polyamideimide elastomer, (B) a polycarbonate resin (preferably a resin produced from bisphenol A as a raw material), (C) a styrenic resin (preferably polybutadiene, styrene-butadiene copolymer), and (D) an electrolyte selected from organic eletrolytes and inorganic eletrolytes (preferably an organic eletrolyte such as a sodium alkylbenzene sulfonate), the amounts of the component A and C being 1-90 pts.wt. and 0.01-10 pts.wt., respectively, per 100 pts.wt. of the total amount of the components B and C. The component A is preferably obtained from caprolactam, a tribasic or tetrabasic polycarboxylic acid and polyoxyalkyleneglycol.


Inventors:
SAKUMA TOSHIHARU
SETOU FUMIKATSU
FUJITA TOMOYUKI
Application Number:
JP25403293A
Publication Date:
April 25, 1995
Filing Date:
October 12, 1993
Export Citation:
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Assignee:
ASAHI CHEMICAL IND
International Classes:
C08L25/02; C08L69/00; C08L73/00; C08L79/08; (IPC1-7): C08L25/02; C08L25/02; C08L69/00; C08L79/08



 
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