Title:
THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH07157651
Kind Code:
A
Abstract:
PURPOSE: To obtain a thermoplastic resin compsn. having a low stiffness, high tensile and impact strength, and a good melt moldability.
CONSTITUTION: This thermoplastic resin compsn. comprises 100 pts.wt. resin component comprising 5-90wt.% polyphenylene ether resin and 95-10wt.% polyamide resin, 0.01-30 pts.wt. compatibilizer, 0.1-100 pts.wt. plasticizer to soften the polyamide resin, and 0-100 pts.wt. rubberlike substance.
Inventors:
SUZUKI YASUAKI
IJICHI YASUTO
IJICHI YASUTO
Application Number:
JP30803093A
Publication Date:
June 20, 1995
Filing Date:
December 08, 1993
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO
International Classes:
C08K5/00; C08L5/00; C08L21/00; C08L71/12; C08L77/00; (IPC1-7): C08L71/12; C08K5/00; C08L5/00; C08L21/00; C08L71/12; C08L77/00
Attorney, Agent or Firm:
Takashi Kuboyama (1 person outside)