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Patent Searching and Data


Title:
THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH07292185
Kind Code:
A
Abstract:

PURPOSE: To obtain the subject composition capable of preventing the foaming from occurring in melt kneading a polycarbonate resin with a polyamide resin, solving problems in thermal stability and eliminating the reduction in molecular weight by blending a specific copolymer with a resin composition comprising the polycarbonate resin and the polyamide resin.

CONSTITUTION: This composition is obtained by blending (A) 100 pts.wt. resin composition comprising a polycarbonate resin and a polyamide resin at a blending weight ratio of (1/9)-(9/1) with (B) 1-50 pts.wt., preferably 1-30 pts.wt. copolymer made by copolymerizing (i) an aromatic vinylic monomer (e.g. styrene) and (ii) a (meth)acrylic ester containing hydroxyl group (e.g. 2-hydroxyethyl acrylate) and/or an α,β-unsaturated carboxylic acid [e.g. (meth)acrylic acid].


Inventors:
NAGAMUNE AKIKO
Application Number:
JP8647594A
Publication Date:
November 07, 1995
Filing Date:
April 25, 1994
Export Citation:
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Assignee:
DAICEL CHEM
International Classes:
C08L25/00; C08L69/00; C08L73/00; C08L77/00; (IPC1-7): C08L25/00; C08L25/00; C08L69/00; C08L77/00