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Patent Searching and Data


Title:
THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH1060290
Kind Code:
A
Abstract:

To obtain the subject composition capable of providing a molding product excellent in impact resistance and processing fluidity and free from delamination by compounding a polycarbonate resin, etc., with a styrene-based resin, etc., and a copolymer containing a specific formamide group.

This resin composition is obtained by compounding (A) 10-90 pts.wt. at least one kind of resin of a polycarbonate resin, a polyamide resin, a polyester resin, etc., with (B) 10-90 pts.wt. at least either one resin in a styrene-based resin and a polyphenylene ether resin, (C) a copolymer of a formamide group-containing monomer (e.g. styrene) represented by the formula (R1 to R6 are each H, a 1-8C alkyl, a 6-10C cycloalkyl or a 6-10C arylalkyl) in an amount of 0.05-20 pts.wt. based on 100 pts.wt. resin composition comprising the components A and B. The resin composition is excellent in impact resistance and processing fluidity and has good appearance and causes no delamination when molded and processed.


Inventors:
KIKUTA MANABU
HOTTA HIROSHI
Application Number:
JP23245796A
Publication Date:
March 03, 1998
Filing Date:
August 13, 1996
Export Citation:
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Assignee:
DAI ICHI KOGYO SEIYAKU CO LTD
International Classes:
C08L25/04; C08L39/00; C08L55/00; C08L55/02; C08L67/00; C08L69/00; C08L71/00; C08L71/12; C08L73/00; C08L77/00; C08L101/00; (IPC1-7): C08L101/00; C08L25/04; C08L39/00; C08L55/02; C08L67/00; C08L69/00; C08L71/12; C08L77/00