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Patent Searching and Data


Title:
THERMOPLASTIC RESIN FOAM
Document Type and Number:
Japanese Patent JPH05111983
Kind Code:
A
Abstract:

PURPOSE: To provide the above thermoplastic resin foam devised so as not to increase the amount of an adhesive used when the thermoplastic resin foam whose surface has many pores is laminated to a metal plate by adding a filler.

CONSTITUTION: In thermoplastic resin foam obtained by foaming a foamable thermoplastic resin sheet containing a large amount of a filler under heating, a heat-sensitive adhesive layer composed of an ethylene/ethyl acrylate/maleic anhydride terpolymer is formed to at least the single surface of the foamable thermoplastic resin sheet.


Inventors:
YASO MIKI
Application Number:
JP27776491A
Publication Date:
May 07, 1993
Filing Date:
October 24, 1991
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
B32B5/18; B32B7/10; B32B27/28; C08J9/04; C08L23/00; (IPC1-7): B32B5/18; B32B7/10; B32B27/28; C08J9/04; C08L23/00
Domestic Patent References:
JPS5935932A1984-02-27
JPH0286673A1990-03-27