Title:
THERMOSETTING ADHESIVE COMPOSITION AND LAMINATED FILM
Document Type and Number:
Japanese Patent JP2021025016
Kind Code:
A
Abstract:
To provide a thermosetting adhesive composition that has a low dielectric constant and a low dielectric loss tangent and that has a high adhesive strength to heat-resistant film.SOLUTION: The thermosetting adhesive composition of the present invention is an adhesive composition containing an oligophenylene ether, a maleimide compound, an epoxy resin, a styrene-based elastomer and a modified polyolefin, and in which the weight ratio of the styrene-based elastomer and the modified polyolefin is 2:1 to 2:3.SELECTED DRAWING: None
Inventors:
ITO HIROSHI
KONDO YASUSHI
HARADA RYU
KONDO YASUSHI
HARADA RYU
Application Number:
JP2019146872A
Publication Date:
February 22, 2021
Filing Date:
August 08, 2019
Export Citation:
Assignee:
TOMOEGAWA PAPER CO LTD
International Classes:
C09J153/00; B32B27/28; C08L23/26; C08L35/00; C08L53/00; C08L63/00; C08L71/12; C09J4/06; C09J7/20; C09J7/28; C09J7/35; C09J123/26; C09J163/00