THERMOSETTING ADHESIVE FILM - NAT STARCH CHEM INVEST

Title:

THERMOSETTING ADHESIVE FILM

Document Type and Number:

Japanese Patent JP2004161990

Kind Code:

A

Abstract:

To provide a film adhesive used for mounting of a semiconductor and capable of rapidly being cured.

The present invention provides a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound and curing agents for the polymer system. The polymer system comprises a base polymer and an electron donor and an electron acceptor functional group. The electron donor and the electron acceptor functional group can be pendant from the base polymer or can be interdispersed with the base polymer as independent compounds.

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Inventors:

NIKOLIC NIKOLA A
ZHANG RUZHI
MUSA OSAMA M
JIN HWAIL
WU BING
SHENFIELD DAVID

Application Number:

JP2003132918A

Publication Date:

June 10, 2004

Filing Date:

May 12, 2003

Export Citation:

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Assignee:

NAT STARCH CHEM INVEST

International Classes:

C09J7/00; C09J5/10; C09J11/06; C09J109/02; C09J125/08; C09J133/00; C09J133/20; C09J157/00; C09J201/00; C09J201/02; C08L25/00; C08L33/00; C08L55/00; (IPC1-7): C09J201/00; C09J7/00; C09J109/02; C09J125/08; C09J133/00; C09J133/20; C09J157/00; C09J201/02

Attorney, Agent or Firm:

Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Akemi Hino
Masaya Nishiyama

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Next Patent: JP2004161992