Title:
THERMOSETTING ADHESIVE SHEET AND FLEXIBLE PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2013010831
Kind Code:
A
Abstract:
To provide a thermosetting adhesive sheet having a thermosetting adhesive agent layer which, after being cured, can achieve high adhesiveness and extremely excellent heat resistance after exposure to humidity and heat.
The thermosetting adhesive sheet is characterized by having a thermosetting adhesive agent layer formed from a thermosetting adhesive composition containing an acrylic polymer (X), an etherified phenol resin (Y) and silica filler (Z1) and/or copper filler (Z2). It is preferable that the acrylic polymer (X) comprises a (meth)acrylic acid alkyl ester (a), having a 1-14C linear or branched alkyl group, as an essential monomer component.
Inventors:
KUWABARA RIE
DAIGAKU NORIJI
HORIGUCHI KEI
FURUTA YOSHIHISA
DAIGAKU NORIJI
HORIGUCHI KEI
FURUTA YOSHIHISA
Application Number:
JP2011143453A
Publication Date:
January 17, 2013
Filing Date:
June 28, 2011
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
C09J7/02; C09J11/04; C09J133/00; C09J133/02; C09J133/08; C09J133/10; C09J171/12; H05K1/03
Attorney, Agent or Firm:
Yukihisa Goto