Title:
THERMOSETTING ADHESIVE SHEET AND USE THEREOF
Document Type and Number:
Japanese Patent JP2022017947
Kind Code:
A
Abstract:
To provide a thermosetting adhesive sheet which has properties of low dielectric constant and low dielectric loss tangent and exhibits good laser processability and drilling processability and high adhesive strength before and after soldering reflow.SOLUTION: There is provided a thermosetting adhesive sheet, wherein a cured product obtained by heating the thermosetting adhesive sheet for one hour at 180°C satisfies the following (i) to (iv): (i) when the thickness of a cured product is 25 μm, the energy ray transmittance at a wavelength of 355 nm is 0 to 40%, (ii) the dielectric constant at a frequency of 10 GHz at 23°C is 1.5 to 3.0, (iii) the dielectric loss tangent at a frequency of 10 GHz at 23°C is 0.0001 to 0.01 and (iv) the linear expansion coefficient α1 at 0°C to Tg is 100 to 500 ppm/°C .SELECTED DRAWING: Figure 1
Inventors:
WAKATABE SATOSHI
MORI SHOTA
MORI SHOTA
Application Number:
JP2020120817A
Publication Date:
January 26, 2022
Filing Date:
July 14, 2020
Export Citation:
Assignee:
TOYO INK SC HOLDINGS CO LTD
International Classes:
C09J7/30; B32B15/08; C09J125/04; C09J177/00; C09J179/08; C09J201/00; H05K1/03
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