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Patent Searching and Data


Title:
THERMOSETTING COMPOSITION AND METHOD FOR CURING THE SAME
Document Type and Number:
Japanese Patent JPH083288
Kind Code:
A
Abstract:

PURPOSE: To obtain a composition which has excellent storage stability and cures at a low temp. to give a cured composition free from discoloration by using a specific complex catalyst as a reactive curing catalyst for an epoxidized compound.

CONSTITUTION: An epoxidized compound (A) is mixed with a compound (B) having reactive silicon groups and a tin chelate catalyst (C). The epoxy groups in the ingredient (A) especially preferably are alicyclic ones. Examples of the ingredient (A) include a polymer obtained by polymerizing an epoxidized ethylenic monomer optionally with another kind of ethylenic monomer. The reactive silicon groups of the compound (B) each comprises a hydrolyzable group, preferably an alkoxyl, directly bonded to a silicon atom. Examples of the ingredient (B) include a (co)polymer of an ethylenic monomer containing a reactive silicon group. The ingredient (C) is desirably an oxygen compound, preferably capable of forming a keto-enol tautomer. Examples thereof include acetoacetic esters and β-diketones.


Inventors:
ISOZAKI OSAMU
TSUNODA MINORU
Application Number:
JP14295094A
Publication Date:
January 09, 1996
Filing Date:
June 24, 1994
Export Citation:
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Assignee:
KANSAI PAINT CO LTD
International Classes:
C08G59/20; C08G59/32; C08G59/70; C09D163/00; (IPC1-7): C08G59/70; C09D163/00
Attorney, Agent or Firm:
Eiji Saegusa (4 others)