Title:
THERMOSETTING COMPOSITION, METHOD FOR PRODUCING THE SAME, AND USE OF THE SAME
Document Type and Number:
Japanese Patent JP2010053323
Kind Code:
A
Abstract:
To provide a thermosetting composition capable of being used in various coating methods such as dispenser coating without lowering its solid concentration and capable of forming a relatively thick (100 m) polyimide film having heat resistance, electrical insulation properties, and low warpage tendency.
The thermosetting composition comprises an alkenyl-substituted nadiimide (C) and a polyamic acid (B) having structural units represented by formula (2) and having a weight-average molecular weight of 25,000-50,000. In formula (2), R3 and R4 are each independently a 2-100C organic group.
Inventors:
Tanioka, Satoshi
Hattori, Takayuki
Hattori, Takayuki
Application Number:
JP2008000222823
Publication Date:
March 11, 2010
Filing Date:
August 29, 2008
Export Citation:
Assignee:
CHISSO CORP
International Classes:
C08L79/08; C08K5/3415; C09D179/04; C09D179/08; H01L21/312; H05K1/03; C08L79/00; C08K5/00; C09D179/00; H01L21/02; H05K1/03