To provide a thermosetting composition for optical semiconductors, which has high transparency, is free from the heat generation and light emission of light-emitting elements, is excellent in adhesiveness to housing materials or the like, and gives cured products little changing hardness, hardly cracking, little reducing surface tackiness and films, even when heated; to provide a sealant used for optical semiconductors and using the thermosetting composition; to provide a die bond material for optical semiconductor element; to provide an underfill material for optical semiconductor element; and to provide an optical semiconductor device using the thermosetting composition for the optical semiconductors, the sealant used for the optical semiconductors, the die bond material for optical semiconductor element, and/or the underfill material for optical semiconductor element.
The thermosetting composition for the optical semiconductors comprises a silicone resin having epoxy-containing groups and alkoxy groups, an acid anhydride, and a metal compound having a Lewis acid property.
WATANABE TAKASHI
NISHIMURA TAKASHI
Katsutoshi Moroda