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Title:
THERMOSETTING COMPOSITION FOR OPTICAL SEMICONDUCTOR, SEALANT FOR OPTICAL SEMICONDUCTOR ELEMENT, DIE BOND MATERIAL FOR OPTICAL SEMICONDUCTOR ELEMENT, UNDERFILL MATERIAL FOR OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2008056857
Kind Code:
A
Abstract:

To provide a thermosetting composition for optical semiconductors, which has high transparency, is free from the heat generation and light emission of light-emitting elements, is excellent in adhesiveness to housing materials or the like, and gives cured products little changing hardness, hardly cracking, little reducing surface tackiness and films, even when heated; to provide a sealant used for optical semiconductors and using the thermosetting composition; to provide a die bond material for optical semiconductor element; to provide an underfill material for optical semiconductor element; and to provide an optical semiconductor device using the thermosetting composition for the optical semiconductors, the sealant used for the optical semiconductors, the die bond material for optical semiconductor element, and/or the underfill material for optical semiconductor element.

The thermosetting composition for the optical semiconductors comprises a silicone resin having epoxy-containing groups and alkoxy groups, an acid anhydride, and a metal compound having a Lewis acid property.


Inventors:
TANIGAWA MITSURU
WATANABE TAKASHI
NISHIMURA TAKASHI
Application Number:
JP2006000238028
Publication Date:
March 13, 2008
Filing Date:
September 01, 2006
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08G59/42; C09J183/06; C09K3/10; H01L21/52; H01L23/29; H01L23/31; H01L33/56; H01L33/62
Attorney, Agent or Firm:
安富 康男
諸田 勝保