Title:
熱硬化性組成物、そのワニスおよび熱硬化物
Document Type and Number:
Japanese Patent JP6570038
Kind Code:
B2
Abstract:
Provided are: a thermally curable composition which contains benzoxazine-based compounds obtained by condensing aromatic diamines, a phenol compound, and an aldehyde compound, the aromatic diamines being a mixture comprising 4,4′-oxydianiline and 3,4′-oxydianiline, the mass ratio of the 4,4′-oxydianiline to the 3,4′-oxydianiline being 50:50 to 80:20; a varnish of the thermally curable composition; and a thermally cured object.
Inventors:
Hiroaki Nakao
Application Number:
JP2016146071A
Publication Date:
September 04, 2019
Filing Date:
July 26, 2016
Export Citation:
Assignee:
JFE Chemical Co., Ltd.
International Classes:
C08G14/073
Domestic Patent References:
| JP11228786A | ||||
| JP2015079762A | ||||
| JP2015522092A |
Foreign References:
| WO2012057298A1 | ||||
| WO2010032719A1 | ||||
| WO2011125665A1 |
Other References:
小椋 一郎、今田 知之,半導体封止材に用いられる新規高性能結晶性エポキシ樹脂の開発,DIC Technical Review,1999年,No.5,P21-30
Attorney, Agent or Firm:
Hideaki Ito
Nozomi Watanabe
Haruko Sanwa
Nozomi Watanabe
Haruko Sanwa