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Title:
THERMOSETTING COMPOUND
Document Type and Number:
Japanese Patent JP2017179120
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting compound which has good solvent solubility and can be rapidly cured by being subjected to heat treatment to form a cured product having super heat resistance.SOLUTION: The thermosetting compound of the present invention is represented by formula (1), where Rand Reach represent a thermosetting group; Dand Dare the same or different and each represent a single bond or a linking group; Ar, Arand Arare the same or different and each represent a divalent aromatic hydrocarbon group or a divalent group in which two or more aromatic hydrocarbons are bonded via a single bond, a divalent aliphatic hydrocarbon group, or a divalent alicyclic hydrocarbon group; and E represents an ester bond.SELECTED DRAWING: None

Inventors:
NAKATANI KOJI
INOUE KEIZO
Application Number:
JP2016068665A
Publication Date:
October 05, 2017
Filing Date:
March 30, 2016
Export Citation:
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Assignee:
DAICEL CORP
International Classes:
C08F22/40
Domestic Patent References:
JP2011225520A2011-11-10
JP2006265527A2006-10-05
JP2016508970A2016-03-24
JP2012529558A2012-11-22
JP2016001213A2016-01-07
JP2017062396A2017-03-30
JP2013006893A2013-01-10
JPH0251520A1990-02-21
JP2005139298A2005-06-02
Foreign References:
WO2009144955A12009-12-03
WO2016002946A12016-01-07
US20080251935A12008-10-16
Attorney, Agent or Firm:
Goto Patent Office