Title:
THERMOSETTING COMPOUND
Document Type and Number:
Japanese Patent JP2017179120
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting compound which has good solvent solubility and can be rapidly cured by being subjected to heat treatment to form a cured product having super heat resistance.SOLUTION: The thermosetting compound of the present invention is represented by formula (1), where Rand Reach represent a thermosetting group; Dand Dare the same or different and each represent a single bond or a linking group; Ar, Arand Arare the same or different and each represent a divalent aromatic hydrocarbon group or a divalent group in which two or more aromatic hydrocarbons are bonded via a single bond, a divalent aliphatic hydrocarbon group, or a divalent alicyclic hydrocarbon group; and E represents an ester bond.SELECTED DRAWING: None
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Inventors:
NAKATANI KOJI
INOUE KEIZO
INOUE KEIZO
Application Number:
JP2016068665A
Publication Date:
October 05, 2017
Filing Date:
March 30, 2016
Export Citation:
Assignee:
DAICEL CORP
International Classes:
C08F22/40
Domestic Patent References:
JP2011225520A | 2011-11-10 | |||
JP2006265527A | 2006-10-05 | |||
JP2016508970A | 2016-03-24 | |||
JP2012529558A | 2012-11-22 | |||
JP2016001213A | 2016-01-07 | |||
JP2017062396A | 2017-03-30 | |||
JP2013006893A | 2013-01-10 | |||
JPH0251520A | 1990-02-21 | |||
JP2005139298A | 2005-06-02 |
Foreign References:
WO2009144955A1 | 2009-12-03 | |||
WO2016002946A1 | 2016-01-07 | |||
US20080251935A1 | 2008-10-16 |
Attorney, Agent or Firm:
Goto Patent Office
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