Title:
熱硬化性環状イミド樹脂組成物
Document Type and Number:
Japanese Patent JP7374565
Kind Code:
B2
Abstract:
To provide a heat-curable cyclic imide resin composition capable of curing at a low temperature without using an aprotic polar solvent such as NMP, and giving a cured product excellent in mechanical characteristics, heat resistance, dielectric constant, dielectric dissipation factor, humidity resistance, and adhesiveness.SOLUTION: The heat-curable cyclic imide resin composition includes: (A) an aromatic bismaleimide compound; (B) a reaction initiator; and (C) an organic solvent, where the number average molecular weight of (A) the aromatic bismaleimide compound is 3,000-50,000, and (C) the organic solvent is one or more kinds selected from the group consisting of methyl ethyl keton (MEK), cyclohexanone, ethyl acetate, tetrahydrofuran (THF), isopropanol (IPA), xylene, toluene, and anisole.SELECTED DRAWING: None
Inventors:
Yoshihiro Tsutsumi
Hiroyuki Iguchi
Yuki Kudo
Hiroyuki Iguchi
Yuki Kudo
Application Number:
JP2020105830A
Publication Date:
November 07, 2023
Filing Date:
June 19, 2020
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08L79/08; C08G73/12; C09D5/00; C09D7/20; C09D179/08; H01L23/29; H01L23/31
Domestic Patent References:
| JP4114035A | ||||
| JP2014065921A | ||||
| JP2013001872A | ||||
| JP2016098303A | ||||
| JP2017071689A | ||||
| JP62181364A | ||||
| JP2016069651A |
Foreign References:
| US20140058057 |
Attorney, Agent or Firm:
Patent Attorney Corporation Ushiki International Patent Office
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