Title:
熱硬化性環状イミド樹脂組成物
Document Type and Number:
Japanese Patent JP7399590
Kind Code:
B2
Abstract:
To provide a thermosetting cyclic imide resin composition whose cured product is excellent in dielectric characteristics and has strong adhesive force to an organic resin and copper.SOLUTION: A thermosetting cyclic imide resin composition contains: (A) a styrenic elastomer; (B) a cyclic imide compound containing at least one dimer acid skeleton, at least one C6 or higher linear alkylene group, and at least two cyclic imide groups in one molecule; (C) an epoxy resin having two or more epoxy groups in one molecule; and (D) a reaction accelerator. The mass ratio of the components (A), (B), and (C) is such that the total amount of the component (B) and the component (C) is 1-50 pts. mass based on 100 pts. mass of the component (A), and the amount of the component (B) is greater than the amount of the component (C).SELECTED DRAWING: None
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Inventors:
Yoshihiro Tsutsumi
Application Number:
JP2021006834A
Publication Date:
December 18, 2023
Filing Date:
January 20, 2021
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08L53/02; C08F287/00; C08F299/02; C08L63/00; C08L79/08; C09J11/06; C09J11/08; C09J153/02
Foreign References:
| WO2020071154A1 | ||||
| WO2020071153A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Ushiki International Patent Office