To obtain the subject composition having a low dielectric constant and a low dielectric loss tangent, excellent in adhesion to a metal, hardly causing scattering of the resin at the operation time, and suitable for a printed circuit board by compounding a siloxane-modified polyimide with a specific compound and a compound having a plurality of maleimide groups.
This composition comprises (A) a siloxane-modified polyimide, (B) a compound having three allyl or methylallyl groups, of formula I (R is H or methyl), and (C) a compound having two maleimide groups. The component A is preferably the one comprising 90-40 mol% unit of formula II (X is a tetravalent aromatic group such as 3,3',4,4'-diphenyl sulfone and 3,3',4,4'-biphenyl; Ar is a divalent group such as formula III), and 10-60 mol% unit of formula IV (R is a 1-10C alkylene, or -CH2OC6H4- in which the methylene is bonded to Si; n is 1-20). Preferably, the component A has 10,000-300,000 weight average molecular weight, and ≤130°C glass transition temperature. The component C is preferably a compound of formula V or the like.
KOBAYASHI MASAHARU
SATO TAKESHI
ORINO DAISUKE
