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Title:
熱硬化性ポリイミド樹脂組成物
Document Type and Number:
Japanese Patent JP5119754
Kind Code:
B2
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Inventors:
Eiju Ichinose
Koichi Murakami
Application Number:
JP2007155044A
Publication Date:
January 16, 2013
Filing Date:
June 12, 2007
Export Citation:
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Assignee:
DIC Corporation
International Classes:
C08L79/04; C08G18/65; C08G59/48; C08G73/10; C08L63/00
Domestic Patent References:
JP2003292575A
JP2004323728A
Foreign References:
WO2005006826A1
Attorney, Agent or Firm:
Kono Tsuyo



 
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