Title:
熱硬化性ポリイミド樹脂組成物
Document Type and Number:
Japanese Patent JP5293182
Kind Code:
B2
Abstract:
A thermosetting polyimide resin composition which, when used in an adhesive layer of a metal-clad laminate, is able to be manufactured by only the solvent removal without requiring an imidation step reaching 300°C or higher and is thermosetting, a cured material of which is excellent in adhesive properties, low in coefficient of water absorption and satisfactory in heat resistance is provided. A thermosetting polyimide resin composition including a polyimide resin having a repeating unit or units having a specified structure and a compound having two or more polymerizable double bonds in one molecule thereof; a film containing the subject thermosetting polyimide resin composition and a metal-clad laminate including an adhesive layer composed of the subject thermosetting polyimide resin composition.
Inventors:
Takeshi Mito
Shuta Kihara
Minao Oishi
Shuta Kihara
Minao Oishi
Application Number:
JP2008525880A
Publication Date:
September 18, 2013
Filing Date:
July 18, 2007
Export Citation:
Assignee:
Mitsubishi Gas Chemical Co., Ltd.
International Classes:
C08L79/08; B32B15/088; C08F2/44; C08F283/04; C08F299/02; C08G73/10; C08J5/18; C09J179/08
Domestic Patent References:
| JP2003155342A | 2003-05-27 | |||
| JP2005015629A | 2005-01-20 | |||
| JP2005146170A | 2005-06-09 | |||
| JP2001006437A | 2001-01-12 | |||
| JP2005171106A | 2005-06-30 |