Title:
熱硬化性樹脂組成物、接着フィルム、銅張り積層板及びプリント配線板
Document Type and Number:
Japanese Patent JP4172179
Kind Code:
B2
Abstract:
To obtain a resin composition as an adhesive having high heat resistance sufficiently resistant to lead free soldering for providing a highly heat resistant copper-clad laminate and a printed-circuit board and provide an adhesive film using the same.
This thermosetting resin composition has 3-20% tensile elongation and 0.05-7% coefficient of thermal expansion at 50-300°C after thermosetting the composition. This adhesive film is prepared by forming a layer of the resin composition at least on one side of a support base or an adherent body in the state of B stage. This copper-clad laminate and this printed-circuit board include the adhesive film or the resin composition.
COPYRIGHT: (C)2003,JPO
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Inventors:
Tetsuya Saito
Kazumasa Takeuchi
Yuko Tanaka
Kazumasa Takeuchi
Yuko Tanaka
Application Number:
JP2002020853A
Publication Date:
October 29, 2008
Filing Date:
January 30, 2002
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
B32B15/088; C08L79/08; B32B15/08; C08L63/04; C08L77/00; C08L101/00; C09J7/02; C09J179/08; C09J201/00; H05K1/03
Domestic Patent References:
| JP7033991A | ||||
| JP10242619A | ||||
| JP2001081438A | ||||
| JP2222477A | ||||
| JP10251610A | ||||
| JP10173097A | ||||
| JP2001332663A | ||||
| JP10130500A | ||||
| JP3252415A | ||||
| JP9077975A | ||||
| JP4306241A | ||||
| JP2286706A |
Foreign References:
| WO2001074927A1 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu