Title:
THERMOSETTING RESIN COMPOSITION AND ADHESIVE FOR OPTICAL SEMICONDUCTOR
Document Type and Number:
Japanese Patent JP2008075025
Kind Code:
A
Abstract:
To provide a thermosetting resin composition which is excellent in UV ray durability, heat resistance, and adhesiveness, is not peeled also after a reflow treatment, and is useful as an adhesive for optical semiconductors.
This thermosetting resin composition comprises a polyorganosiloxane having an epoxy equivalent of 350 to 1,600 g/mole, a polyorganosiloxane having an epoxy equivalent of 150 to 350 g/mole, and a metal chelate compound.
Inventors:
YOSHII KIMIHIKO
AKIIKE TOSHIYUKI
AKIIKE TOSHIYUKI
Application Number:
JP2006257892A
Publication Date:
April 03, 2008
Filing Date:
September 22, 2006
Export Citation:
Assignee:
JSR CORP
International Classes:
C08L63/00; C08G59/20; C08G59/70; C08K5/07; C09J11/06; C09J163/00; C09J183/06; C09K3/10; H01L23/29; H01L23/31; H01L33/56; H01L33/62
Attorney, Agent or Firm:
Masataka Oshima
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