Title:
THERMOSETTING RESIN COMPOSITION AND APPLICATION THEREOF
Document Type and Number:
Japanese Patent JP2016153476
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition used for manufacturing a film-shaped adhesive excellent in shear strength and peel strength.SOLUTION: There is provided a thermosetting resin composition containing at least a compound represented by the following formula (1). In the formula (1), Rrepresents bivalent organic group having at least an amide bond, Rrepresents a bivalent group binding to an aromatic ring and each independently represents a direct bond or a bivalent organic group having no amide bond binding to an aromatic ring, Rrepresents each independently a hydrocarbon group capable of being substituted, Rrepresents a group binding to an aromatic ring and each independently represents a hydrocarbon group capable of being substituted and n represents each independently an integer of 0 to 3.SELECTED DRAWING: None
Inventors:
IWAZAWA HARUO
FUJITOMI SHINTARO
FUJITOMI SHINTARO
Application Number:
JP2015227598A
Publication Date:
August 25, 2016
Filing Date:
November 20, 2015
Export Citation:
Assignee:
JSR CORP
International Classes:
C08G14/073; C08G59/40; C08L61/34; C09J7/00; C09J11/06; C09J163/00; C09J163/02
Domestic Patent References:
| JP2009518465A | 2009-05-07 | |||
| JP2008231287A | 2008-10-02 | |||
| JPH1171498A | 1999-03-16 | |||
| JP2013010889A | 2013-01-17 |
Foreign References:
| CN102827095A | 2012-12-19 |
Attorney, Agent or Firm:
Patent corporation ssinpat