Title:
THERMOSETTING RESIN, THERMOSETTING COMPOSITION CONTAINING THE SAME, AND MOLDED ARTICLE AND CURED ARTICLE OBTAINED FROM THE SAME
Document Type and Number:
Japanese Patent JP2010174155
Kind Code:
A
Abstract:
To provide a thermosetting resin having both excellent dielectric constant and heat resistance; a thermosetting composition containing the same; and a cured article and a molded article obtained from the same.
The thermosetting resin includes a dihydrobenzoxazine ring structure of the general formula (I). In the general formula (I), each R1-R8 represents a group selected from the group consisting of 1-10C organic groups.
Inventors:
HAYASHI YUYA
EGUCHI YUJI
EGUCHI YUJI
Application Number:
JP2009019115A
Publication Date:
August 12, 2010
Filing Date:
January 30, 2009
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08G14/073; C08G73/00; C08L61/34
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Toshifumi Onuki