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Title:
熱硬化性樹脂組成物およびその硬化物
Document Type and Number:
Japanese Patent JP7157601
Kind Code:
B2
Abstract:
To provide a thermosetting resin composition forming a cured product excellent in low dielectric properties, high heat resistance, high adhesion, and the like.SOLUTION: The resin composition comprises a hydroxy group-containing imide resin represented by general formula (1) defined by H-L-(X-L)n-H, and a compound capable of a crosslinking reaction with imido groups. In the formula, L are structural units of formula (2) and phenolic structural units, where the equivalent ratio between the hydroxy groups and the imido groups originating therefrom is between 10/90 and 90/10; and X is a crosslinking group.SELECTED DRAWING: None

Inventors:
Tomoyuki Takashima
Ishihara Kazuo
Hiroshi Sato
Masami Omura
Application Number:
JP2018166691A
Publication Date:
October 20, 2022
Filing Date:
September 06, 2018
Export Citation:
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Assignee:
Nippon Steel Chemical & Material Co., Ltd.
International Classes:
C08L65/00; C08F299/02; C08G16/04; C08G59/40; C08G61/10; C08G73/10; C08L61/32; H01L23/29; H01L23/31
Domestic Patent References:
JP7053678A
Attorney, Agent or Firm:
Kazuya Sasaki
Eiichi Sano
Katsumi Hara
Shuji Hisamoto
Naruse Katsuo