PURPOSE: The titled composition which can give a cured product excellent in heat resistance and thermal cycling resistance and useful as an electrical insulating material, comprising a specified polyimide and a monomer capable of ring opening polymerization.
CONSTITUTION: A thermosetting resin composition is obtained by mixing 100pts. wt. polyimide having at least two groups of formula I (wherein D is a bivalent group having a polymerizable carbon-to-carbon double bond) with 10W200pts.wt. monomer capable of ring opening polymerization of formula II, wherein Ca is a bivalent 2 C or higher (un)substituted hydrocarbon and X is functional group capable of ring opening polymerization selected from among -CH=CH-, a hetero atom of O, N or S and an atomic group containing at least one of these atoms. After the addition of 0.001W10wt% polymerization catalyst (e.g., benzoyl peroxide), this composition is cured by heating at 100W300°C for 1W50hr.
KATAGIRI JUNICHI
WAJIMA MOTOYO
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