THERMOSETTING RESIN COMPOSITION, AND ELECTRONIC DEVICE USING CURED PRODUCT THEREOF

Title:

THERMOSETTING RESIN COMPOSITION, AND ELECTRONIC DEVICE USING CURED PRODUCT THEREOF

Document Type and Number:

Japanese Patent JP2017197616

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition with a high refractive index and/or a high transmission.SOLUTION: The problem is solved by a thermosetting resin composition that contains a carboxyl group-containing compound (A) and inorganic fine particles (B) with a primary particle size of 1-100 nm. When formed into a cured film, the thermosetting resin composition has a refractive index (nD) of 1.6-3.0.

Inventors:

ANRAKU HIROSHI
HIROTA TAKAYUKI
WATANABE NAOKI
TANAKATAKURO

Application Number:

JP2016087933A

Publication Date:

November 02, 2017

Filing Date:

April 26, 2016

Export Citation:

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Assignee:

JNC CORP

International Classes:

C08L79/08; C08G73/10; C08K3/00; C08K5/101; C08L63/00; C09D7/12; C09D11/10; C09D11/30; C09D167/00; C09D179/08; C09D201/08; H01L51/50; H05B33/02; H05B33/04

Domestic Patent References:

JP2015010096A	2015-01-19
JP2008274234A	2008-11-13

Attorney, Agent or Firm:

Hiroshi Kobayashi
Tsukasa Iguchi
Yasuhito Suzuki

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