Title:
THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN FILM AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2020041070
Kind Code:
A
Abstract:
To provide a thermosetting resin composition having excellent handleability and workability when made into a film, and having high adhesion to a base material, and a cured product of the thermosetting resin composition having low elasticity.SOLUTION: A thermosetting resin composition contains the following components (A)-(C). (A) silicone-modified epoxy resin: 90-10 pts.mass, (B) maleimide compound with a weight average molecular weight (Mw) of 2,500-50,000: 10-90 pts.mass (where, the total of (A) and (B) components is 100 pts.mass), (C) curing catalyst.SELECTED DRAWING: None
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Inventors:
KUSHIHARA NAOYUKI
KUDO YUKI
SUMIDA KAZUMASA
TSUTSUMI YOSHIHIRO
HAMAMOTO YOSHIHIDE
KUDO YUKI
SUMIDA KAZUMASA
TSUTSUMI YOSHIHIRO
HAMAMOTO YOSHIHIDE
Application Number:
JP2018170321A
Publication Date:
March 19, 2020
Filing Date:
September 12, 2018
Export Citation:
Assignee:
SHINETSU CHEMICAL CO
International Classes:
C08G59/30; C08F22/40; C08G59/32; C08L35/00; C08L63/00
Domestic Patent References:
| JP2018083893A | 2018-05-31 | |||
| JP2017088799A | 2017-05-25 | |||
| JP2018024747A | 2018-02-15 | |||
| JPH0543658A | 1993-02-23 |
Attorney, Agent or Firm:
Ushiki International Patent Office
Mamoru Ushiki
Mamoru Ushiki