Title:
熱硬化性樹脂組成物およびその硬化物
Document Type and Number:
Japanese Patent JP6764885
Kind Code:
B2
Abstract:
To provide a thermosetting resin composition capable of providing a cured article excellent in dielectric property, and a cured article thereof.SOLUTION: There are provided a thermosetting resin composition containing a dicyclopentadiene-type epoxy resin (A), a novolak type phenol resin (B), a copolymer of indenes and maleic acid anhydride (C), and a curing catalyst (D), in which molar number a of an epoxy group in the dicyclopentadiene-type epoxy resin, molar number b of a phenolic hydroxyl group in the novolak type phenol resin (B), and molar number c of an acid anhydride group in the copolymer of indenes and maleic acid anhydride (C) satisfy a following relationship, and a cured article obtained by heating and curing the thermosetting resin composition. a:b+c=1.00:1.10 to 1.00:0.45. b:c=96:4 to 65:35.SELECTED DRAWING: None
Inventors:
Kazuya Takemura
Application Number:
JP2018002418A
Publication Date:
October 07, 2020
Filing Date:
January 11, 2018
Export Citation:
Assignee:
JFE Chemical Co., Ltd.
International Classes:
C08G59/24; C08L45/00; C08L63/00
Domestic Patent References:
| JP10330461A | ||||
| JP11124427A | ||||
| JP2012153896A | ||||
| JP9249794A | ||||
| JP2015166431A | ||||
| JP201739909A |
Attorney, Agent or Firm:
Hideaki Ito
Hirohisa Hachiya
Haruko Sanwa
Hirohisa Hachiya
Haruko Sanwa