THERMOSETTING RESIN COMPOSITION FOR LIGHT REFLECTION AND SUBSTRATE FOR MOUNTING OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR DEVICE USING THE RESIN COMPOSITION

Japanese Patent JP2017020026

A

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for light reflection high in refraction factor from visible light to near-ultraviolet light after curing, excellent in heat deterioration resistance and tablet moldability and hardly generating flash during transfer molding, a manufacturing method therefor and a substrate for an optical semiconductor element and an optical semiconductor device using the resin composition.SOLUTION: There is provided a thermosetting resin composition for light reflection containing an epoxy resin containing triglycidyl isocyanurate, a curing agent containing at least one selected from hexahydro phthalic anhydride, isocyanuric acid derivative and cyclohexane tricarboxylic anhydride, a curing accelerator, an inorganic filler containing at least one selected from silica, aluminum hydroxide, magnesium hydroxide, barium sulfate, magnesium carbonate and barium carbonate, a white pigment and a nanoparticle filler.SELECTED DRAWING: Figure 1

KOTANI HAYATO
URASAKI NAOYUKI
YUASA KANAKO
NAGAI AKIRA
HAMADA MITSUYOSHI

JP2016147434A

January 26, 2017

July 27, 2016

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HITACHI CHEMICAL CO LTD

C08L63/06; C08G59/32; C08G59/42; C08K3/00; H01L33/60; H05K1/03; H01L33/48

JP2006140207A	2006-06-01
JP2001220496A	2001-08-14
JPH06132427A	1994-05-13
JP2003292734A	2003-10-15
JP2006241230A	2006-09-14
JP2006265370A	2006-10-05
JP2006156704A	2006-06-15
JP2003224305A	2003-08-08

Hidekazu Miyoshi
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu

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