Title:
THERMOSETTING RESIN COMPOSITION AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2009046592
Kind Code:
A
Abstract:
To provide a thermosetting resin composition with excellent heat resistance, satisfactory electric characteristics, and remarkably improved brittleness, and a manufacturing method therefor.
A polyfunctional phenol compound, a diamine compound and an aldehyde compound are heated to react each other to obtain the thermosetting resin having dihydro benzoxazine structure expressed by general formula (IV), and a layered silicate is added further thereto, in this manufacturing method for the thermosetting resin composition of the present invention.
Inventors:
CHIKU YOSHINORI
YOKOTA REONA
YOKOTA REONA
Application Number:
JP2007214186A
Publication Date:
March 05, 2009
Filing Date:
August 20, 2007
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08L61/34; C08G14/06; C08K3/34
Domestic Patent References:
JP2003064180A | 2003-03-05 | |||
JP2004269853A | 2004-09-30 | |||
JPH0959334A | 1997-03-04 | |||
JP2007106800A | 2007-04-26 | |||
JP2004123742A | 2004-04-22 | |||
JP2001040053A | 2001-02-13 |
Foreign References:
WO2005056683A1 | 2005-06-23 | |||
WO2007037206A1 | 2007-04-05 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Suzuki Isobe
Suzuki Isobe