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Title:
THERMOSETTING RESIN COMPOSITION AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2009046592
Kind Code:
A
Abstract:

To provide a thermosetting resin composition with excellent heat resistance, satisfactory electric characteristics, and remarkably improved brittleness, and a manufacturing method therefor.

A polyfunctional phenol compound, a diamine compound and an aldehyde compound are heated to react each other to obtain the thermosetting resin having dihydro benzoxazine structure expressed by general formula (IV), and a layered silicate is added further thereto, in this manufacturing method for the thermosetting resin composition of the present invention.


Inventors:
CHIKU YOSHINORI
YOKOTA REONA
Application Number:
JP2007214186A
Publication Date:
March 05, 2009
Filing Date:
August 20, 2007
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08L61/34; C08G14/06; C08K3/34
Domestic Patent References:
JP2003064180A2003-03-05
JP2004269853A2004-09-30
JPH0959334A1997-03-04
JP2007106800A2007-04-26
JP2004123742A2004-04-22
JP2001040053A2001-02-13
Foreign References:
WO2005056683A12005-06-23
WO2007037206A12007-04-05
Attorney, Agent or Firm:
Hidekazu Miyoshi
Suzuki Isobe