THERMOSETTING RESIN COMPOSITION AND MATERIAL FOR SEALING SEMICONDUCTOR

Title:

THERMOSETTING RESIN COMPOSITION AND MATERIAL FOR SEALING SEMICONDUCTOR

Document Type and Number:

Japanese Patent JP2002220437

Kind Code:

A

Abstract:

To provide a resin composition which gives a cured product having excellent moisture resistance and good welding crack resistance, especially a suitable cured product, in a material for sealing semiconductor.

The thermosetting resin composition has, as essential components, a curing agent (A), which comprises a phenolic resin having a structure obtained by adding to an aromatic hydrocarbon containing a phenolic hydroxyl group in a molecule (a) a compound having two ethylenically unsaturated double bonds (b1) and a compound having an ethylenically unsaturated double bond (b2), and an epoxy resin (B).

Inventors:

KAGE TAKAKAZU
AZUMA YOJI
KUNITOMO HIDEO
KANO HIDEKI

Application Number:

JP2001359198A

Publication Date:

August 09, 2002

Filing Date:

November 26, 2001

Export Citation:

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Assignee:

DAINIPPON INK & CHEMICALS

International Classes:

C08G61/02; C08G59/62; H01L23/29; H01L23/31; (IPC1-7): C08G59/62; C08G61/02; H01L23/29; H01L23/31

Domestic Patent References:

JPH09194575A	1997-07-29
JPH0578457A	1993-03-30
JPH0873570A	1996-03-19

Attorney, Agent or Firm:

Takahashi victory

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