THERMOSETTING RESIN COMPOSITION, AND PREPREG, FILM WITH RESIN, LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE USING THE COMPOSITION

Japanese Patent JP2015086253

A

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition exhibiting excellent low curing shrinkage, low thermal expansion, good dielectric characteristics, and high elasticity, and to provide a prepreg, a film with a resin, a laminate, a printed wiring board, and a semiconductor package using the above thermosetting resin composition.SOLUTION: The thermosetting resin composition comprises: an aromatic azomethine compound (A) having at least one aldehyde group in one molecule obtained by reacting an aromatic amine compound (i) having at least two primary amino groups in one molecule with an aromatic aldehyde compound (ii) having at least two aldehyde groups in one molecule; a siloxane compound (B) having at least two primary amino groups at a molecular end; and a maleimide compound (C) having at least two N-substituted maleimide groups in one molecule. Also disclosed are a prepreg, a film with a resin, a laminate, a printed wiring board, and a semiconductor package using the above thermosetting resin composition.

KOTAKE TOMOHIKO
NAGAI SHUNSUKE
HASHIMOTO SHINTARO
ABE SHINICHIRO
MIYATAKE MASATO
TAKANEZAWA SHIN
MURAI HIKARI

JP2013223857A

May 07, 2015

October 29, 2013

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HITACHI CHEMICAL CO LTD

C08G12/08; B32B5/28; B32B15/08; C08J5/18; C08J5/24; C08L61/22; H01L23/14; H05K1/03

JPH04202529A	1992-07-23
JP2011195476A	2011-10-06
JP2012001486A	2012-01-05
JP2007246628A	2007-09-27
JPS63264635A	1988-11-01

WO2012099132A1	2012-07-26
WO2012099133A1	2012-07-26

Tamotsu Otani
Kenichi Hirasawa

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